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LED Substrate
Properties：
a.High thermal conductivity;
b.Excellent hermeticity;
c.Excellent size control,surface finish and flatness Semi-finished or finished (Ni/Au plated) products available.
- Information
Product Name：
Molybdenum Substrate
Molydbenum content:
≥99.96%
Application field:
LED chip heat dissipation substrate
Product customization:
it can be produced and processed according to drawings or samples, and the production cycle is about 30 days
The company’s double-sided polishing molybdenum substrate,moly wafer, molybdenum Moly substrate, molybdenum wafer polishing to mirror (Ra ＜ 0.03um). Molybdenum Moly base plate and molybdenum copper base plate have good conductivity, are not easy to crack, and have excellent heat dissipation effect. It can be used as the heat dissipation substrate of LED high current chip or the best choice of reflector substrate.